| 发明名称 |
Epoxy resin composition for encapsulating semiconductor |
| 摘要 |
<p>Provided is an epoxy resin composition having low moisture absorption and excellent solder-crack resistance for encapsulating semiconductor comprising: (A) an epoxy resin represented by formula (1) <CHEM> (B) a curing agent having a phenolic hydroxyl group, and (C) inorganic filler in an amount of 60 to 98% by weight based on the whole composition, and the epoxy resin composition is preferably used for a resin-encapsulated type semiconductor apparatus.</p> |
| 申请公布号 |
EP1174455(B1) |
申请公布日期 |
2004.09.29 |
| 申请号 |
EP20010117045 |
申请日期 |
2001.07.12 |
| 申请人 |
SUMITOMO CHEMICAL COMPANY, LIMITED |
发明人 |
ENDO, KAZUHISA;NAKAJIMA, NOBUYUKI;SAITO, NORIAKI |
| 分类号 |
C08L63/00;C08G59/08;C08G59/24;C08G59/32;C08G59/62;H01L23/29;H01L23/31;(IPC1-7):C08G59/08;H01L23/28 |
主分类号 |
C08L63/00 |
| 代理机构 |
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