发明名称 Adapter for surface mount devices to through hole applications
摘要 An electrical adapter formed of a printed wiring board having opposing primary and secondary sides and at least one printed circuit having a plurality of solder pads arranged to interconnect with input/output signal pins of a surface mount technology (SMT) device and a plurality of plated vias arranged to interconnect with input/output signal pins of one or more discrete electrical components; one or more plated through holes extending between the primary and secondary sides of the board and electrically coupled to the printed circuit, the plated through holes being positioned in a pattern structured to match plated through holes in a parent circuit board; and a plurality of input/output signal interconnect pins mechanically and electrically coupled to the plated holes and extending a distance beyond the secondary side of the board.
申请公布号 US6796807(B2) 申请公布日期 2004.09.28
申请号 US20030431915 申请日期 2003.05.07
申请人 HONEYWELL INTERNATIONAL, INC. 发明人 OLZAK RICHARD A.;KHAN TEHMOSP
分类号 H05K1/14;H05K3/34;H05K3/42;(IPC1-7):H01R12/00 主分类号 H05K1/14
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