发明名称 |
TRACK GAP FILLED RESIN PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME CAPABLE OF IMPROVING INSULATING PROPERTY BETWEEN TRACKS |
摘要 |
PURPOSE: A track gap filled resin PCB and a method for manufacturing the same are provided to achieve improved insulating property between tracks and voltage resistance by filling a resin in a track gap and preventing a delamination. CONSTITUTION: A dielectric layer(1) is formed in the inner center of a printed circuit board, and a conductor pad(2) and a trace(3) are formed at both outer surfaces of the printed circuit board. A track gap is formed between the conductor pad and the trace. The track gap is filled with a track gap filled resin(10) so as to achieve improved insulating property and voltage resistance. A solder mask(4) formed on the track and the track gap filled resin is higher than a surface finish(5) formed on the conductor pad.
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申请公布号 |
KR20040082112(A) |
申请公布日期 |
2004.09.24 |
申请号 |
KR20030016755 |
申请日期 |
2003.03.18 |
申请人 |
YOUNGEUN ELECTRONICS CO., LTD. |
发明人 |
CHO, HYEON GWI |
分类号 |
H05K3/00;(IPC1-7):H05K3/00 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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