发明名称 |
PROJECTION ALIGNER, PROJECTION EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To improve the throughput of a work for exposing a circuit pattern while forming an unexposed part in the vicinity of the outer circumference of a circular substrate. SOLUTION: A circular masking blade 3 comprises a plate having a circular opening, and shuts off a light emitted to the vicinity of the outer circumference of a substrate 1 to form an unexposed part in the vicinity of the outer circumference of the substrate 1. When one shot is finished and the substrate 1 is stepwise moved, a controller 51 drives an XY moving mechanism 31 so as to move XY positions of the circular masking blade 3 in a way of keeping a relative position between the substrate 1 and the opening of the circular masking blade 3 constant. After the substrate 1 and the circular masking blade 3 are moved, a succeeding shot is carried out and repeating the operations above exposes the entire substrate 1. COPYRIGHT: (C)2004,JPO&NCIPI
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申请公布号 |
JP2004266125(A) |
申请公布日期 |
2004.09.24 |
申请号 |
JP20030055579 |
申请日期 |
2003.03.03 |
申请人 |
HITACHI HIGH-TECH ELECTRONICS ENGINEERING CO LTD |
发明人 |
KOMORIYA SUSUMU;TSURU TETSUO |
分类号 |
G03F7/20;H01L21/027;(IPC1-7):H01L21/027 |
主分类号 |
G03F7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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