发明名称 PROJECTION ALIGNER, PROJECTION EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To improve the throughput of a work for exposing a circuit pattern while forming an unexposed part in the vicinity of the outer circumference of a circular substrate. SOLUTION: A circular masking blade 3 comprises a plate having a circular opening, and shuts off a light emitted to the vicinity of the outer circumference of a substrate 1 to form an unexposed part in the vicinity of the outer circumference of the substrate 1. When one shot is finished and the substrate 1 is stepwise moved, a controller 51 drives an XY moving mechanism 31 so as to move XY positions of the circular masking blade 3 in a way of keeping a relative position between the substrate 1 and the opening of the circular masking blade 3 constant. After the substrate 1 and the circular masking blade 3 are moved, a succeeding shot is carried out and repeating the operations above exposes the entire substrate 1. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004266125(A) 申请公布日期 2004.09.24
申请号 JP20030055579 申请日期 2003.03.03
申请人 HITACHI HIGH-TECH ELECTRONICS ENGINEERING CO LTD 发明人 KOMORIYA SUSUMU;TSURU TETSUO
分类号 G03F7/20;H01L21/027;(IPC1-7):H01L21/027 主分类号 G03F7/20
代理机构 代理人
主权项
地址