发明名称 MOLDED PRODUCT OF SURFACE-CONDUCTIVE RESIN
摘要 PROBLEM TO BE SOLVED: To provide a molded product of a surface-conductive resin excellent in surface smoothness, transparency, economical efficiency, etc., by applying a conductive resin composition having large lowering of surface resistivity even when the compounded amount of conductive fibrous filler is reduced to the surface of the molded product. SOLUTION: In the molded product of the surface-conductive resin, a coated film layer of a conductive resin composition satisfying a composition composed of (A) 0.1-30 wt.% conductive fibrous filler, (B) 0.05-89.9 wt.% conductive resin and (C) 10-99.85 wt.% non-conductive matrix which is an organic polymer resin containing at least one kind of group selected from a group consisting of a carboxylic acid, phosphonic acid, phosphinic acid and salts of these acids, wherein a weight ratio of component (B)/component (A) is 0.5-5 is provided on the surface of the resin molded product. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004256712(A) 申请公布日期 2004.09.16
申请号 JP20030050220 申请日期 2003.02.27
申请人 TOYOBO CO LTD 发明人 AIKAWA YASUSHI;YAMAGUCHI HIROKI
分类号 C08J7/04;C08K7/06;C08L49/00;C08L65/00;C08L79/00;C08L101/06;C08L101/12;(IPC1-7):C08L101/06 主分类号 C08J7/04
代理机构 代理人
主权项
地址