摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package for housing a light emitting element which can be mounted highly reliably on the wiring conductor of an external electric circuit board without causing any positional deviation nor being inclined with high joint strength and is high in working efficiency and, in addition, on which a plurality of light emitting elements can be mounted so that the elements may make full-color light emission. <P>SOLUTION: This package for housing light emitting element is constituted by laminating a frame body 2 having through holes surrounding a plurality of mounting sections 1a upon the upper surface of a belt-like substrate 1 on which the plurality of mounting sections 1a is formed in a row for mounting light emitting elements 3. The substrate 1 has notched sections 7 formed by notching its four corners from the upper surface to the lower surface of the substrate 1, and having arcuate shapes in the top view under the frame body 2 and side-face conductors formed on the inner peripheral surfaces of the notched sections 7. The electrodes of the light emitting elements 3 mounted on the mounting sections 1a are electrically connected to the side-face conductors. <P>COPYRIGHT: (C)2004,JPO&NCIPI |