发明名称 POLYAMIDE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin composition excellent in mechanical characteristics, heat resistance, and chemical resistance. SOLUTION: The polyamide resin composition is obtained by melting and kneading a blend of (A) 100 pts.wt. of a polyamide resin formed from aliphatic diamines comprising mainly pentamethylenediamine and hexamethylenediamine, and dicarboxylic acids comprising mainly terephthalic acid with (B) 5-100 pts.wt. of an inorganic filler. It is desirable that the polyamide resin (A) comprises one having a melting point of 290-330°C, a glass transition temperature of 130°C or higher, and a relative viscosity of 1.5 to 5.0 and that the inorganic filler (B) comprises glass fibers or carbon fibers. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004250513(A) 申请公布日期 2004.09.09
申请号 JP20030040734 申请日期 2003.02.19
申请人 TORAY IND INC 发明人 AKITA MASARU;KATO KIMIYA;NISHIMURA TORU;SAWAI HIDEKI
分类号 C08L77/06;C08K3/00;C08K7/02;(IPC1-7):C08L77/06 主分类号 C08L77/06
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