| 摘要 |
PROBLEM TO BE SOLVED: To reduce the diameter of a three-dimensional electronic endoscope that facilitates the mounting of electronic parts on the market even when a microminiature solid-state imaging device is used and makes the most of the microminiature solid-state imaging device. SOLUTION: The imager is structured by connecting a right side circuit board 16R made up of front side board portions 17a and 18a of the same width d<SB>1</SB>as the right to left width and rear side board portions 17b and 18b of a width d<SB>2</SB>larger than the same to a right side CCD device 10R, connecting a left side circuit board 16L made up of front side board portions 22a and 23a of the width d<SB>1</SB>and rear side board portions 22b and 23b of the greater width d<SB>2</SB>also to a left side CCD device 10L, connecting the circuit boards to a lead wire 13, and mounting electronic parts 20 and 24 on the rear side board portions 17b and 23b. Consequently the electronic parts 20 and 24 on the market can be easily mounted on the rear side board portions 17b and 18b formed in a large size by projecting into the rear side area of the other CCD. COPYRIGHT: (C)2004,JPO&NCIPI
|
