METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a technique which can reduce contaminations by preventing impregnation of polishing water into the backside of a semiconductor wafer during polishing of the wafer backside and can increase productivity by increasing the number of available products and using a 2:1 mask for exposure of a passivation film. SOLUTION: The method comprises a step of forming a photosensitive polyimide resin (referred to as Pi, hereinafter) on the main surface of the semiconductor wafer 1 and then removing PiQ 3 from scribe lines 4, a step of applying a surface protective tape on the surface of the wafer 1 and polishing the backside of the wafer 1, and a step of cutting the wafer at the scribe lines 4 to obtain individual chips 2. Polishing water is prevented from impregnating into a gap between the surface protective tape and the scribe lines 4 during polishing of the backside of the wafer 1 by a bank pattern 3a formed at part of the scribe lines 4 to be the same layer as the PiQ 3. COPYRIGHT: (C)2004,JPO&NCIPI