| 摘要 |
PROBLEM TO BE SOLVED: To reduce inspection time and thus reduce costs therefor in inspecting electric characteristics of each semiconductor element formed on a semiconductor wafer, and to uniformize stresses imposed on each semiconductor element during the inspection for facilitation of quality control of the semiconductor elements. SOLUTION: In inspecting the electric characteristics of the semiconductor elements formed on the semiconductor wafer by using an asymmetrical probe card for multi-probing, a probe card having a symmetrical location and a probe card having an asymmetrical location in terms of software are adapted to be used properly at every touchdown, so as to avoid repeated inspection of a particular semiconductor element. COPYRIGHT: (C)2004,JPO&NCIPI
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