| 摘要 |
PROBLEM TO BE SOLVED: To prevent the occurrence of any crack on an upper face of a substrate at the time of welding a sealing ring and a lid body in a semiconductor element containing package where the sealing ring is brazed to the upper surface of the substrate. SOLUTION: The semiconductor element containing package is provided with the ceramic substrate 1 where a recessed part 1b for placing and storing a semiconductor element 5 on the upper face, and the metallic sealing ring 2 whose lower face is bonded to a periphery of the recessed part 1b on the upper face of the substrate 1 and in which extending parts 2a and 2b extending outward are formed on upper and lower ends for a whole periphery. In the sealing ring 2, the width of the extending part 2a at the upper end is larger than that of the extending part 2b at the lower end. COPYRIGHT: (C)2004,JPO&NCIPI
|
