发明名称 Optical package structure
摘要 An optical package structure (2) includes a cover (21) with a lens part (22), and a base member (23) which combines with the cover to define a closed space in which to package optical components. The base member has a bottom panel (232) and a substrate (234). A plurality of solder pads (231, 237) is provided on a top and bottom surfaces (2321, 2342) of the bottom panel and of the substrate. The solder pads on the top surface electrically connect with the optical components. A plurality of inner conductive traces (236, 238) is provided through the bottom panel and the substrate which electrically connect the solder pads on the top surface of the bottom panel with corresponding solder pads on the bottom surface of the substrate via printed circuits (235) on the substrate. Thus, an external electrical connection of the optical components is attained without wires and electrical pins.
申请公布号 US6787890(B2) 申请公布日期 2004.09.07
申请号 US20020198976 申请日期 2002.07.18
申请人 HON HAI PRECISION IND. CO., LTD 发明人 HUANG NAN TSUNG;MOU CHUNG SHIN
分类号 H01S5/02;H01S5/022;(IPC1-7):H01L23/02;H01L27/15;H01L33/00 主分类号 H01S5/02
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