| 摘要 |
PROBLEM TO BE SOLVED: To provide a package substrate which can correspond to fining processing, has small stress generated due to the difference of a thermal expansion coefficient to a semiconductor device, has high reliability and enables reduction in cost and weight. SOLUTION: A carbon fiber reinforced resin laminated board 18 is joined by a solder resist 19 on a circuit substrate 10 formed of a polyimide resin. A connection terminal 11c and pattern wirings 11a, 11b connected to a semiconductor substrate 20 are formed in the circuit substrate 10. The carbon fiber reinforced resin laminated board 18 is formed by laminating a plurality of carbon fiber reinforced resin sheets with carbon fibers arranged in one direction and is provided with an opening part 18a according to the semiconductor device 20 to be packaged. COPYRIGHT: (C)2004,JPO&NCIPI
|
