| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technology for preventing a semiconductor chip from being in contact with a wire exfoliated by deformation of a substrate or dicing of each substrate. <P>SOLUTION: In a semiconductor device on which semiconductor chips are mounted by using an adhesive layer located on a substrate formed with wires wherein the wires of the tape substrate and stud bumps of the semiconductor chips are in contact and continuity with each other, the adhesive layer integrated in a form of films in units of blocks comprising substrates equivalent to a plurality of the semiconductor devices and thermo compression bonding is applied to the adhesive layer, and the adhesive layer equivalent to a plurality of the semiconductor devices is continuously formed to cover a wire forming face of the end of the substrates. Further, a thermosetting resin is employed for the adhesive layer, and the semiconductor chips and the substrates are bonded by thermo compression bonding in a state where the substrates are placed on a hard thermal insulation plate. According to the manufacturing method above, the hard thermal insulation plate prevents thermal diffusion and also deformation of the substrates at the same time. Moreover, in the case of applying dicing to the substrates, the exfoliation of the wires from the substrates is prevented by retaining the wires with the adhesive layer at the end of the substrates. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
