发明名称 |
Electroless plating method and device, and substrate processing method and apparatus |
摘要 |
There is provided an electroless plating method and device which can form a plated film having an improved uniformity of film thickness with an enhanced selectivity, while preventing the formation of fine pores in the plated film. The electroless plating method comprises, bringing a substrate into contact with an electroless plating solution to form a plated film on the surface of the substrate, and scrubbing the surface of the plated film formed or being formed on the surface of the substrate.
|
申请公布号 |
US2004170766(A1) |
申请公布日期 |
2004.09.02 |
申请号 |
US20040476698 |
申请日期 |
2004.03.29 |
申请人 |
INOUE HIROAKI;KIMURA NORIO;NAKAMURA KENJI;MATSUMOTO MORIJI |
发明人 |
INOUE HIROAKI;KIMURA NORIO;NAKAMURA KENJI;MATSUMOTO MORIJI |
分类号 |
C23C18/16;C23C18/31;H01L21/288;H01L21/304;H01L21/3205;H01L21/768;H01L23/52;H05K3/24;H05K3/26;(IPC1-7):B05D3/12;B05D3/12 |
主分类号 |
C23C18/16 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|