| 摘要 |
PROBLEM TO BE SOLVED: To improve the yield of semiconductor devices by respectively forming the identification marks to each chip forming region and the backside region of a semiconductor wafer corresponding to such chip forming region before the step to form a bump region on each ship forming region. SOLUTION: A mark-forming layer 10 is provided at the backside 15Y of each semiconductor chip 15 to cover the backside 15Y. This mark-forming layer 10 is formed of a carbon-doped epoxy-based thermosetting resin. Various kinds of identification marks are formed on the mark-forming layer 10 and one of these identification marks is formed of the marks indicating the information pieces such as product name, manufacturer's name, type, manufacturing lot number, etc., as the common information in one semiconductor wafer. Moreover, such a mark is formed of the two-dimensional code mark that can record a large amount of information within a small area. Thereby, the yield of the semiconductor device can be improved. |
