| 摘要 |
PROBLEM TO BE SOLVED: To mitigate a dimensional tolerance and mechanical or thermal stress generated upon attaching the high frequency signal pin of a stem to the strip line of a circuit substrate and rigidly connect with a low cost while maintaining high frequency transmission characteristics in a transmission rate 10Gbps. SOLUTION: Two bent parts 411a, 411 are formed in the high frequency signal pins 41a, 41b to form a stepped part 421. A length from the terminal ends of the bent part side of the high frequency signal pins 41a, 41b in the connecting part between the high frequency signal pins 41a, 41b and conductor pads 301a, 301b to the terminal ends of the conductor pads 301a, 301b is specified so as to be not longer than 0.6mm. COPYRIGHT: (C)2004,JPO&NCIPI
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