发明名称 PROTECTING RESIN-ENCAPSULATED COMPONENTS
摘要 A method of protecting surface mount capacitors (40) from moisture and oxygen corrosion by applying a thermally curable pre-coat resin (48) to a portion of the terminals (41, 43) of a capacitor (40) and encapsulating the capacitor element(s) (42) with a protective resin (46). The pre-coat resin (48) is substantially rigid at ambient temperatures and flexible at elevated temperatures and is preferably a lactone-containing epoxy resin. The pre-coat resin (48) may be applied to a solder coating-free portion (50) of the terminals (41, 43) by brush or wiper prior to encapsulating the capacitor element(s) (42) with the protective resin (46).
申请公布号 WO2004072998(A2) 申请公布日期 2004.08.26
申请号 WO2004US03763 申请日期 2004.02.10
申请人 KEMET ELECTRONICS CORPORATION;MELODY, BRIAN, JOHN;KINARD, JOHN, TONY;PERSICO, DANIEL, F.;STOLARSKI, CHRIS;LESSNER, PHILLIP, MICHAEL;CHEN, QINGPING;PRITCHARD, KIM;HARRINGTON, ALBERT, KENNEDY;WHEELER, DAVID, ALEXANDER 发明人 MELODY, BRIAN, JOHN;KINARD, JOHN, TONY;PERSICO, DANIEL, F.;STOLARSKI, CHRIS;LESSNER, PHILLIP, MICHAEL;CHEN, QINGPING;PRITCHARD, KIM;HARRINGTON, ALBERT, KENNEDY;WHEELER, DAVID, ALEXANDER
分类号 H01G9/00;H01G9/012;H01L23/495 主分类号 H01G9/00
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