| 摘要 |
PROBLEM TO BE SOLVED: To prevent solder at a connection part from cracking by effectively absorbing stress generated owing to difference in thermal expansion while maintaining self-alignment effect and high holding force that a solder ball has. SOLUTION: A flexible resin core conductive ball 17 is used for a connection terminal where stress generated owing to the difference in thermal expansion between a semiconductor package and a mount substrate is relatively large. The solder ball 18 is used for the other connection terminal to maintain the self-alignment effect depending upon the surface tension of fused solder at the time of reflowing and also secure the holding force at the time of reflowing while the semiconductor package is arranged on the reverse surface of the mount substrate, thereby preventing the semiconductor package from falling. The solder ball 18 and a resin core conductive ball 17 are properly arranged to improve the reliability of connection when the semiconductor package is mounted on the mount substrate. COPYRIGHT: (C)2004,JPO&NCIPI
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