发明名称 THERMOELECTRIC MODULE
摘要 PROBLEM TO BE SOLVED: To provide a high-performance thermoelectric module which has superior shock resistance. SOLUTION: The thermoelectric module has base substrates 1a and 1b, a plurality of thermoelectric elements 2 which are arrayed on the base substrates 1a and 1b, a wire conductor 3 which electrically connects the plurality of thermoelectric elements 2 to one another, and an external connection terminal 4 which is provided on the base substrates 1a and 1b and electrically connected to the wire conductor 3. Reinforced elements whose differences in mean coefficient of thermal expansion from the thermoelectric elements 2 are≤20% and which are≥10% larger than the mean hardness of the thermoelectric elements 2 are substituted for some of the plurality of thermoelectric elements 2. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004235367(A) 申请公布日期 2004.08.19
申请号 JP20030021174 申请日期 2003.01.29
申请人 KYOCERA CORP 发明人 TANAKA KOICHI
分类号 C22C28/00;H01L35/16;H01L35/32;H01L35/34;(IPC1-7):H01L35/32 主分类号 C22C28/00
代理机构 代理人
主权项
地址