| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer wiring board of fine wiring, low resistance, and high dimensional precision. <P>SOLUTION: A wiring circuit layer 3 is formed on the surface of a ceramic green sheet, and the green sheets 1 are laminated in a plurality of numbers. After a restrictive sheet 5 whose main component is the ceramic material which is hard to be sintered is laminated at least on one surface of the laminate, the laminate is sintered at or below the temperature of the melting point of the wiring circuit layer. The restrictive sheet 5 is removed by blasting the compressed air containing water-soluble abrasive particles. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
