VAPOR DEPOSITION SYSTEM AND METHOD

摘要

PROBLEM TO BE SOLVED: To provide a vapor deposition system and a vapor deposition method which can suppress the phenomenon that the film thickness of a multiplex thin-film layer on a substrate is made ununiform in a radial pattern periodicallly in its plane. SOLUTION: In the system in which evaporation sources 3a and 3b are heated so that evaporation points are moved at a prescribed period inside a vacuum chamber A to evaporate evaporation materials, so that the evaporation materials are vapor-deposited on the substrate 8 rotated at a fixed revolving speed to deposit the thin film of the evaporation materials, the revolving speed of the substrate 8 is made changeable. COPYRIGHT: (C)2004,JPO&NCIPI