| 摘要 |
PROBLEM TO BE SOLVED: To provide a a metallizing composition and a ceramic wiring board using this, preventing drop in plating capability, enhancing external appearance, keeping adhesive strength, reducing warping of the board, and reducing the deformation of the board by controlling the contraction behavior in baking. SOLUTION: The method of manufacturing the wiring board contains a process unitedly baking a metallizing layer mainly comprising a ceramic green sheet and copper powder, and the copper powder is coated with a metal oxide causing vitrification at 700-800°C and±50°C of contraction starting temperature of the green sheet. COPYRIGHT: (C)2004,JPO&NCIPI |
