| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a package for housing a semiconductor element and a semiconductor device which can dissipate effectively heat generated by a semiconductor element to the outside and atmosphere, bond the element firmly to a heat dissipating member, and have high sealing reliability by sealing resin. <P>SOLUTION: The package for housing a semiconductor element 8 is provided with a heat dissipating member 3 which is constituted of tungsten or molybdenum and copper and has an installation portion on which a semiconductor element 7 is mounted in a central part of the upper surface, and an insulating frame 1 which is attached on the upper surface of the member 3 and has a plurality of wiring conductors 11. Sealing resin 2 for sealing the element 7 is injected in a recessed part 1a constituted of the member 3 and the frame 1. In the member 3, a penetrating metal body 5 composed of copper is embedded from the installation part to the lower surface. Copper layers 6 (6a, 6b) are bonded to the upper and the lower surfaces of the part position where the metal body 5 is embedded. The metal body 5 has circumference which is larger than the circumference of the element 7 by the thickness of the member 3. Heat conduction of the member 3 is superior, so that the heat generated by the element 7 can be dissipated effectively to the outside and atmosphere. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
