发明名称 |
Composite metal column for mounting semiconductor device |
摘要 |
<p>An integrated circuit chip (903), which has a plurality of pads (903b) and non-reflowable contact members (1201) to be connected by reflow attachment to external parts. Each of these contact members (1201) has a height-to-diameter ratio and uniform diameter favorable for absorbing strain under thermomechanical stress. The members have a solderable surface (1202) on each end and a layer of reflowable material on each end. Each member is solder-attached (1204) at one end to a chip contact pad (903b), while the other end (1203) of each member is operable for reflow attachment to external parts. <IMAGE></p> |
申请公布号 |
EP1443548(A3) |
申请公布日期 |
2004.08.18 |
申请号 |
EP20030104978 |
申请日期 |
2003.12.24 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
TELLKAMP, JOHN P;MATSUNAMI, AKIRA |
分类号 |
B23K3/06;B23K35/00;B23K35/02;B23K35/14;H01L21/60;H01L23/00;H01L23/485;H05K3/34;(IPC1-7):H01L21/60;H05K3/00;B23K35/26 |
主分类号 |
B23K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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