| 摘要 |
PROBLEM TO BE SOLVED: To improve the substrate treating through of a semiconductor treating device. SOLUTION: An untreated substrate S1 is supported by the upper fork 66a of the catcher 66 of a transporting mechanism 60 and, in addition, a treated substrate S2 is supported by supporting pins 11 at a second position above a pedestal 10. Under this condition, the catcher 66 is advanced to a prescribed position above the pedestal 10. Then, while the catcher 66 is stopped, the supporting pins 11 are lowered and, at the same time, supporting rods 12 are raised. Consequently, the untreated substrate S1 is delivered from the upper fork 66a to the rods 12 and, in addition, the treated substrate S2 is simultaneously delivered from the supporting pins 11 to a lower fork 66b. |
