发明名称 Method of manufacturing an integrated circuit carrier
摘要 A method of manufacturing an integrated circuit carrier includes providing a substrate. At least one receiving zone for an integrated circuit is demarcated on the substrate. A plurality of island-defining portions is arranged about each of the receiving zones. Rigidity-reducing arrangements are created between neighboring island-defining portions by removing material from the substrate.
申请公布号 US6775906(B1) 申请公布日期 2004.08.17
申请号 US20000693484 申请日期 2000.10.20
申请人 SILVERBROOK RESEARCH PTY LTD 发明人 SILVERBROOK KIA
分类号 H01L23/12;H01L21/48;H01L23/13;H01L23/14;H01L23/498;H05K1/02;H05K3/34;(IPC1-7):H05K3/02;H05K3/10 主分类号 H01L23/12
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