| 摘要 |
Disclosed are an electronic component sucking device and an electronic component testing apparatus using the same, the sucking device comprising a suction head having at its extremity an opening arranged to suck an electronic component when a negative pressure is applied thereto; a hold-down center rod having an aperture, a conduit through which passes a gas supplied or discharged through the opening of the suction head, and a hold-down portion at its extremity adapted to be inserted into the interior of the suction head; a coil spring for imparting a biasing force to the suction head and the hold-down center rod; and a link lever interposed between the suction head and the hold-down center rod; whereinwhen the hold-down center rod is subjected to a force pressing down against the biasing force of the coil spring, the link lever pushes the suction head upward so that the hold-down portion of the hold-down center rod protrudes from the suction head.
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