发明名称 |
End-point detection apparatus |
摘要 |
An apparatus is provided for polishing a substrate. The apparatus includes a polishing pad configured to traverse from at least a first point to a second point. A first sensor is located near the first point and oriented so as to sense an incoming temperature of the polishing pad. A second sensor is located near the second point and oriented so as to sense an outgoing temperature of the polishing pad. A difference between the incoming temperature and the outgoing temperature is then used to determine endpoint of a polishing operation.
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申请公布号 |
US2004157531(A1) |
申请公布日期 |
2004.08.12 |
申请号 |
US20030749983 |
申请日期 |
2003.12.30 |
申请人 |
LAM RESEARCH CORPORATION |
发明人 |
MIKHAYLICH KATRINA A.;RAVKIN MIKE;GOTKIS YEHIEL |
分类号 |
B24B21/04;B24B37/04;B24B49/14;(IPC1-7):B24B49/00;B24B51/00 |
主分类号 |
B24B21/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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