| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic control apparatus which realizes reduction in size while maintaining the heat radiating property. <P>SOLUTION: A thick film resistor 30 is formed at the lower surface 12 of a circuit substrate 10. The thick film resistor 30 is bonded to the internal surface of a metal case 1 via a covering insulation film 31. A recessed portion 40 is formed to the surface 12 where the thick film resistor 30 is formed in the circuit substrate 10. Moreover, a part or entire part of semiconductor chip 41 forming the circuit is flip chip mounted to the bottom surface of the concave portion 40. Over the upper surface 11 of the circuit substrate 10, the remaining components (20, 21, 23) to form the circuit are surface-mounted. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
