| 发明名称 |
SEMICONDUCTOR DEVICE WITH PAD |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a pad which needs no cleaning nor sharpening of a probe pin. <P>SOLUTION: In the semiconductor device having a pad, first conductors 1a and second conductors 1b are arranged on the front surface of a pad 1. The first conductors 1a have a hardness which is higher than that of the second conductors 1b and is not lower than that of the probe pin 11. The first conductors 1a are arranged on the front surface of the pad in such a manner that, while the probe pin 11 slides over the front surface of the pad 1 in contact with the front surface of the pad 1, the probe pin 11 may hit the first conductors 1a at least once. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
| 申请公布号 |
JP2004228314(A) |
申请公布日期 |
2004.08.12 |
| 申请号 |
JP20030013766 |
申请日期 |
2003.01.22 |
| 申请人 |
RENESAS TECHNOLOGY CORP;KYOEI SANGYO KK |
发明人 |
KIMURA NAOKI;SUGIHARA KEIJI |
| 分类号 |
H01L21/66;H01L21/3205;H01L23/485;H01L23/52;H01L23/58;(IPC1-7):H01L21/320 |
主分类号 |
H01L21/66 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
