发明名称 |
Heat-expandable microsphere and process for producing the same |
摘要 |
The invention provides a thermally foamable microsphere having a structure with a foaming agent encapsulated in a shell formed of a polymer, wherein the shell contains an organosilicon compound, and a process for producing a thermally foamable microsphere having a structure with a foaming agent encapsulated in a shell formed of a polymer by suspension polymerization of a polymerizable mixture containing at least a foaming agent and a polymerizable monomer in an aqueous dispersion medium, wherein the polymerizable mixture is suspension polymerized in the presence of the organosilicon compound.
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申请公布号 |
US2004157057(A1) |
申请公布日期 |
2004.08.12 |
申请号 |
US20030480207 |
申请日期 |
2003.12.10 |
申请人 |
TASAKI YASUHIRO;ASAI GENZO;SATAKE YOSHITKATSU |
发明人 |
TASAKI YASUHIRO;ASAI GENZO;SATAKE YOSHITKATSU |
分类号 |
B01J13/14;B01J13/18;C08F2/18;C08F2/44;C09K3/00;D21H17/59;D21H21/54;(IPC1-7):B32B25/20 |
主分类号 |
B01J13/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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