| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem wherein a loop of power supply wiring on a mounting substrate outside of a semiconductor integrated circuit is enlarged to reduce the effect of a bypass capacitor by an inductance component and a resistance component of the loop when the bypass capacitor is provided on the mounting substrate to cope with power supply noise of a high frequency which is generated with the switching operation of a transistor of a digital circuit in the semiconductor integrated circuit including the digital circuit and an analog/digital circuit. SOLUTION: In the semiconductor integrated circuit of a multilayer configuration wherein power supply wiring 11 and ground wiring 12 to which input/output buffers 2, 3 are connected are formed to surround the circumference and an insulating film is interposed between layers, the power supply wiring 11 and the ground wiring 12 in a portion between the input/output buffers 2, 3 are formed to be alternately laminated via the insulating film between the layers, thereby being functioned as a capacitor. COPYRIGHT: (C)2004,JPO&NCIPI
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