COOL-DOWN CHAMBER OF RTP APPARATUS

摘要

PURPOSE: A cool-down chamber of an RTP(rapid thermal processing) apparatus is provided to prevent a rapid temperature variation of a wafer and prevent the wafer from being damaged by a thermal shock by making a high-temperature wafer contact a cool-down pedestal while the temperature of the wafer is reduced to a predetermined temperature while using cooling gas. CONSTITUTION: A cooling gas supplying line(40) is branched to upper and lower parts with respect to the wafer so as to supply cooling gas, positioned at one end of a wafer loading/unloading hole. A cooling gas exhausting line(42) is branched to upper and lower parts with respect to the wafer so as to exhaust the cooling gas, positioned at the other end of the wafer loading/unloading hole. A cooling gas switching valve(50) is installed in the cooling gas supplying line to switch on/off the flow of the cooling gas. A control unit(60) controls the cooling gas switching valve.