FLIP-CHIP PACKAGE WITH PROTECTIVE CAP AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A flip-chip package and a manufacturing method thereof are provided to sustain excellent heat-transfer property and to prevent effectively the damage of the backside of a semiconductor chip by using a protective cap. CONSTITUTION: A flip-chip package includes a semiconductor chip, a PCB(Printed Circuit Board), a molding resin layer, a plurality of solder balls and a protective cap. The semiconductor chip(10) has an active side(12) and a backside(14). The PCB(20) is electrically connected with the active side of the semiconductor chip. The molding resin layer(50) is used for enclosing selectively the resultant structure. The plurality of solder balls(70) are formed on the lower surface of the PCB. The protective cap(40) is attached to the backside of the semiconductor chip. The protective cap has a protruding portion(40a). A dovetail groove(46) for flowing molding resin is formed in the protruding portion of the protective cap. The protective cap is made of metal.