TAPE PACKAGE IN WHICH TEST PAD IS FORMED IN REAR FACE AND ITS INSPECTING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a tape package in which a test pad is formed in the rear face and to provide its inspecting method. SOLUTION: The compatibility of a probe card is expanded by unification of a profile of the test pad. The accuracy in the electric inspection is improved by extending the pitch of the test pad. The test pad which can shorten full length of the tape package is formed in rear face of the tape package. Therefore, the test pad of the upper face is located on the rear face of a base substrate through a through hole of the base substrate. This method is applicable to the tape package used for an LCD, and its inspecting method. COPYRIGHT: (C)2004,JPO&NCIPI