| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solder bump structure along with its manufacturing method capable of preventing occurrence of defects of an apparatus caused by cracks and fissures extending over the entire solder bump. <P>SOLUTION: The solder bump structure includes a contacting pad, an intermediate layer formed on the contacting pad, and the solder bump formed on the an intermediate layer, and at least one metallic projection is projected onto the surface of the intermediate layer and buried into the solder bump. The cracks occurring in the solder bump tends to extend in a horizontal direction, and, in this case, the metallic projection functions as an obstacle disturbing extending of the cracks. Such the obstacle disturbing extending of the cracks can reduce possibility of the apparatus defects by prolonging the extending pathway of the cracks. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
