| 摘要 |
PROBLEM TO BE SOLVED: To provide a system and method for cleaning a process chamber or a vacuum line. SOLUTION: The progress of cleaning a process chamber or a vacuum line is monitored by measuring the cleanliness of a sample of the inside surface of the process chamber or the vacuum line. To this end, the surface sample is subjected to the action of cleaning gases at some times, and is subjected to the action of a test plasma generated by a test plasma source at other times. The test plasma stimulates the atoms on the surface sample, and produces radiation that is measured with a spectrometer. The spectrometer transmits signals to a control means to close a solenoid valve for supplying the cleaning gases to the process chamber or the vacuum line, when cleaning is sufficient. This prevents excessive and overlong cleaning liable to degrade the inside surface of the process chamber or the vacuum line. COPYRIGHT: (C)2004,JPO&NCIPI
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