MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE EQUIPPED WITH OVERLAPPING INSPECTION PROCESS

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor device by which an applying mask can be confirmed efficiently and the production yield of the semiconductor device can be improved, and which has overlapping inspection processes.

SOLUTION: In the etching process 100, a resist film is exposed/etched in a photoengraving process (S101). A overlapping inspection using a mark on the layer side to be overlapped and the mark on the resist film side is conducted by an overlapping inspection device (S102A). An applying-mask confirming process (S102B) is carried out simultaneously by using the overlapping inspection device in the process.

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