发明名称 |
OPTIMIZED CONDUCTIVE LID MOUNTING FOR INTEGRATED CIRCUIT CHIP CARRIERS |
摘要 |
An optimized lid mounting for electronic device carriers, using standard manufacturing process steps of semiconductor packaging, optimizing heat dissipation and electromagnetic interference shielding is disclosed. According to the invention, conductive blocks or springs are soldered to ground pads of the chip carrier on their lower side. On the other side, these conductive blocks or springs are electrically connected to the lid with conductive adhesive material such as silicone based material. Furthermore, the lid is thermally connected to the semiconductor chip with electrical insulative adhesive material.
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申请公布号 |
US2004150097(A1) |
申请公布日期 |
2004.08.05 |
申请号 |
US20030707206 |
申请日期 |
2003.11.26 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
GAYNES MICHAEL A.;OGGIONI STEFANO;VIERO GIORGIO |
分类号 |
H01L23/12;H01L23/00;H01L23/16;H01L23/31;H01L23/34;H01L23/36;H01L23/498;(IPC1-7):H01L23/12;H01L23/10 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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