首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
Bonding composition
摘要
申请公布号
AU775627(B2)
申请公布日期
2004.08.05
申请号
AU20000032596
申请日期
2000.05.09
申请人
KURARAY CO., LTD.
发明人
KENICHI HINO
分类号
A61K6/08;A61K6/00;C09J4/02;C09J201/00;C09J201/02;(IPC1-7):A61K6/083
主分类号
A61K6/08
代理机构
代理人
主权项
地址
您可能感兴趣的专利
ENHANCED PROTEIN TRANSDUCTION
Pb-free solder-connected electronic article
DOOR ASSEMBLY WITH TWO DOOR LEAVES
METHODS OF DIAGNOSING AND TREATING AGE-RELATED MACULAR DEGENERATION
Bubble reduction device, chromotography device, bubble reduction method, and bubble reduction program
INJECTION MOLDING METHOD AND INJECTION MOLDING DEVICE
CHALCONE LINKED PYRROLO[2,1-C[[1, 4]BENZODIAZEPINE HYBRIDS AS POTENTIAL ANTICANCER AGENTS AND PROCESS FOR THE PREPARATION THEREOF
SUPPORT DEVICE
INTRAVAGINAL ADMINISTRATION OF MISOPROSTOL
LATCHING CONNECTION DEVICE AND LED CABINET, LED DISPLAY SCREEN PROVIDED WITH THE SAME
Portable data carrier
TILTING MECHANISM FOR A VESSEL
BCL-2/BCL-XL INHIBITORS AND THERAPEUTIC METHODS USING THE SAME
PINCH VALVE
Nobel metal based connection means in the form of a foil with a solid faction and a liquid fraction and application and production method for same
一种辊拉模用硬质合金轧辊
一种工具柜
一种便携式足球门
立式综合加工机第四轴回转机构
一种钢筋混凝土船形礁体
