MATERIAL FOR ELECTRONIC COMPONENTS, METHOD OF CONNECTING MATERIAL FOR ELECTRONIC COMPONENTS, BALL GRID ARRAY TYPE ELECTRONIC COMPONENTS AND METHOD OF CONNECTING BALL GRID ARRAY TYPE ELECTRONIC COMPONENTS

摘要

A material for an electronic component having a plating layer A formed of metals X and Y mixed with each other on a base metal material and a coating layer B formed of the metal X provided on the plating layer A is provided, whereby wettability of soldering is satisfactory ensured, degradation of solderability and appearance is prevented and generation of whiskers can also be prevented.