| 摘要 |
PROBLEM TO BE SOLVED: To provide a micro film capacitor which can be reduced to a chip size by the use of a specific metallized film. SOLUTION: The film capacitor uses the metallized film which is composed of a base film, a release layer formed on the one surface of the base film, a patterned metal electrode layer formed on the release layer, and an adhesive layer formed on the metal electrode layer. The adhesive layer is a heat-resistant insulating resin layer, and the metal electrode layer is as thick as 100 to 2000Å. The film capacitor may use the metallized film which is provided with a separating layer interposed between the release layer and the metal electrode layer. COPYRIGHT: (C)2004,JPO&NCIPI
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