| 摘要 |
PURPOSE:To improve the yield of production of semiconductor devices, and enable the high density mounting on a printed wiring board, by constituting a chip in a plurality of divided small scale ones, and assembling them step-wise in a package. CONSTITUTION:Lead frames 3, 3' are sealed in a package 2, and arranged step-wise. Chips 4, 4' are bonded to die islands of the frames 3, 3'. A package 2 has the respective step-parts on the outer side surfaces from which the respective pins 31, 31' protrude. The pins 31, 31' are bent downward from the surfaces of the respective step-parts. That is, inside the arrangement group of pins 31, the arrangement group of pins 31' are aligned. Thereby, the yield of production of semiconductor devices are increased, and the high density mounting on a printed wiring board is enabled. |
