| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition that has excellent impregnating properties into a narrow gap, allows little precipitation of fillers and generates few voids, and to provide a highly credible electronic component device having a high moldability, wherein an element such as a semiconductor is flip-chip mounted on a substrate so that its circuit-forming surface faces the circuit forming surface of the substrate via a bump, and the resin composition is filled into the gap between the element and the substrate. SOLUTION: A solventless liquid epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler as indispensable components and optionally (D) a curing accelerator, and having a viscosity ratioη<SB>1</SB>/η<SB>2</SB>of less than 0.8 is used, wherein the ratio is a thixotropic index obtained by measuring with a rotational viscometer at rotation numbers, n<SB>1</SB>and n<SB>2</SB>(n<SB>1</SB>/n<SB>2</SB><0.5). COPYRIGHT: (C)2004,JPO&NCIPI |
