| 摘要 |
<P>PROBLEM TO BE SOLVED: To reinforce and miniaturize the ground of an underside ground electrode for an upper semiconductor chip in a semiconductor module in which the two semiconductor chips are loaded under a laminated state. <P>SOLUTION: A lower semiconductor chip is fixed onto the indentation bottom of the top face of a module substrate, and the upper semiconductor chip is fixed onto the top face of a supporter composed of a conductor mounted on the top face of the substrate in the periphery of an indentation. External electrode terminals and radiation pads are installed on the underside of the substrate. A plurality of vias connected to the pads are formed to the indentation bottom. The supporter is fitted on the vias connected to the pads. The pads are set at a ground potential. A chip-shaped electronic part such as a chip resistor, a chip capacitor, a chip inductor or the like is loaded on the top face of the substrate. The semiconductor chip is connected to wirings for the substrate by conductive wires. The underside ground electrode for the upper semiconductor chip is connected to the pads at the ground potential through vias. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
