| 摘要 |
PROBLEM TO BE SOLVED: To provide fundamentally structural and metallurgical solutions against a heat mechanical stress reliability, and a consistent/low cost flip chip assembly of an integrated circuit chip and a semiconductor device. SOLUTION: An integrated circuit chip 903 having a plurality of pads 903b and a contact member 1201 unavailable to reflow which is connected to an external part by a reflow attaching is disclosed. Each of these contact members 1201 has the ratio of height to diameter and a homogeneous diameter which make it convenient to absorb a strain under a heat mechanical stress, respectively. The member has a surface 1202 possible to be soldered at each end portion and a material layer possible to be applied by the reflow at each end portion. In each member, the one end 1204 is soldered to a chip contact padding 903b and the other end 1203 is connected to the external part by the reflow attaching. COPYRIGHT: (C)2004,JPO&NCIPI |
