| 摘要 |
<P>PROBLEM TO BE SOLVED: To form a resist film without coating defects by supplying the resist solution stably onto a substrate. <P>SOLUTION: At the leading end of a resist discharge nozzle 1, a guide bar 13 extended toward the substrate 4 from the center of the leading end is arranged. While the leading end of the resist discharge nozzle 1 is arranged in the vicinity of the surface of the substrate 4, resist solution 14 is discharged from the leading end at a low discharge rate of 0.5 cc/sec, and the discharged resist solution 14 is fed onto the surface of the substrate 4 via the guide bar 13. After the resist discharge nozzle 1 is removed by rotating the substrate 4 at a high speed, the resist solution 14 is spread over the whole surface of the substrate 4. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
