| 摘要 |
To provide a resin composition which is suitable for use as a material for optical parts and disk substrates and molded products thereof <??>The resin composition comprises: (1) 10 to 90 wt% of a first hydrogenated, polymerized styrene which contains a hydrogenated, polymerized styrene unit in an amount of more than 95 wt% and 99.99 wt% or less and has a weight average molecular weight of 30,000 to 300,000; and (2) 10 to 90 wt% of a second hydrogenated, polymerized styrene which contains a hydrogenated, polymerized styrene unit in an amount of 60 to 95 wt% and has a weight average molecular weight of 30,000 to 200,000, "wt%" being based on 100 wt% of the total of the first hydrogenated, polymerized styrene and the second hydrogenated, polymerized styrene. <IMAGE>
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