| 摘要 |
PROBLEM TO BE SOLVED: To provide an integrated cooling device for at least either an electrical apparatus or an electronic device. SOLUTION: The invention relates to a cooling device for electrical/electronic equipment 5. The cooling device comprises a base body 3 having thermal conductivity which has an envelope surface 7 and is constituted in order to connect to the equipment 5 which should be cooled simultaneously, a cooling structure 9 which is arranged apart from the base body 3 and partly surrounds at least one section of the envelope surface 7 simultaneously, and fleeces 19 which are attached to the envelope surface 7 of the base body 3 and impregnated with liquid simultaneously. A closed/gas-exhausted space 11 is formed between the base body 3 and the cooling structure 9. COPYRIGHT: (C)2004,JPO&NCIPI |
